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TE Connectivity
Reflowable Thermal Protection for
Power Electronics Designs in Rugged Environments
PRELIMINARY PERFORMANCE CHARACTERISTICS (TYPICAL UNLESS OTHERWISE SPECIFIED)
Resistance and Open Characteristics
P 1 to P TH
Min
RTP200R060SA
Typ
Max
Units
R PP (Resistance from P 1 to P TH )
Operating Voltage
Open Temperature, post-arming
Thermal Resistance: Junction to Case
Installation dependent Operating Current,
post-arming (2)(3)
@ 23+/-3°C
@ 175+/-3°C
-
I PP = 0
Case = P TH pad
@ 23+/-3°C
@ 100+/-3°C
@ 175+/-3°C
–
–
-
19 6
–
32
27
–
0.6
0.8
32
20 5
0.5
34
28
10
0.8
1.2
-
21 3
–
–
–
–
m Ω
V DC
°C
°C/W
A
Moisture Sensitivity Level Rating
(4)
–
–
1
–
–
ARMING CHARACTERISTICS
Arming Characteristics
ARM
Min
RTP200R060SA
Typ
Max
Units
Arming Type
Electronically Armed
–
R ARM (Resistance from ARM to P 1 or P TH )
Pre-Arming
Post-Arming
–
10
300
–
–
–
m Ω
K Ω
Arming Current (I ARM )
(2)
@ 23 +/-3°C
2
–
5
A
Arming Time (@23 +/-3°C) (2)
@ 2A
@ 5A
–
–
0.10
0.01
–
–
Sec
(2)
(3)
(4)
Results obtained on 44.5 x 57.2 x 1.6 (in mm) single layer FR4 boards with 70 μ m (2oz) Cu traces, a 645mm 2 , 70 μ m (2oz) Cu heat spreader connected to the
P TH pad, and a 387mm 2 Cu heat spreader connected to the P 1 pad of the RTP device.
(See RTP device test board drawing) Results are highly installation dependent.
Operating current is measured on the RTP test boards at the specified temperature. It is a highly installation dependent value.
As per JEDEC J-STD-020C.
te.com/RTP-Launch/
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